Stacked DRAM pads connected by TSV in combination with a high bandwidth memory interface (HBM).
In electronic engineering, silicon or TSV (through-silicon via) routes are vertical connections that completely pass through both the silicon wafers and the individual surfaces of integrated circuits, known as chips or dice. . The technology of creation of the TSV is used as part of the process of manufacturing 3D chips, which include dozens of memory layers stacked.
Thanks to the TSV technology, the three-dimensional chips can be packaged in such a way that the area used is minimal without this implying a reduction in chip functionality. In addition, it also enables the reduction of critical paths between the components, thus increasing the speed of operations.
As for the manufacturing process of these tracks, they are usually made by laser or some other more or less complex drilling method, to later be filled with copper or some other conductive material.
Also, depending on the material used in the joints, it is convenient to perform the TSV at a different time in the process of manufacturing the 3D chips. In this way, the recommendations are the following:
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